Methods of Making and Using Reactive Shaped Charge Shock Initiation Devices Including Reactive Multilayer Structures

ABSTRACT

The invention provides shock initiation devices comprising multilayer structures with constituent layers that undergo an exothermic self-propagating reaction once initiated by shock. The multilayer structures may be used as components in shaped charges, EFP devices, warheads, munition casings, interceptors, missiles, bombs, and other systems. The reactive layer materials may be selected based on required structural properties, density and reaction temperature.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a divisional of U.S. patent application Ser. No.10/855,298 filed May 27, 2004, which claims the benefit of U.S.Provisional Patent Application Ser. No. 60/473,509 filed May 27, 2003.Application Ser. No. 10/855,298 is also is a continuation-in-part ofU.S. application Ser. No. 10/839,638 filed May 5, 2004. Each of theseapplications is incorporated herein by reference.

GOVERNMENT CONTRACT

The United States Government has certain rights to this inventionpursuant to Contract No. DASG-60-02-0171 awarded by the U.S. Army SpaceMissile Defense Command, Contract No. N68936-03-C-0019 awarded by theU.S. Navy, and Contract No. F08630-02-SC-0048 awarded by the U.S. AirForce.

FIELD OF THE INVENTION

The present invention relates to reactive devices, and more particularlyrelates to shock initiation devices such as reactive shaped charges,munitions casings, kinetic interceptors and the like, which includereactive multilayer structures.

BACKGROUND INFORMATION

Exothermic warhead technology has been shown to produce benefits bycombining kinetic and thermal energies in the attack process (Bailey andNooker, “Coruscative Liner Materials”, Applied Physics Lab, 1963). Laterstudies by Zaviatsanos and Riley (1990) further confirmed the benefitsof reactive intermetallic systems as fragmenting warhead systems.Exothermic or pyrophoric materials have also been investigated forcompound target effects, such as the initiation of fuels and othercombustibles. However, the radial dispersion of thermal energy ofconventional reactive intermetallic materials is low, and the materialsare subject to shielding. For conventional penetrators to performoptimally, key characteristics include material density, fracturetoughness and grain size/orientation. In some existing systems, grainsize can be on the order of millimeters. This large grain structureproduces orientation anomalies, e.g., from the pancake forging process,and is in part responsible for a high rejection rate of forged linerproducts.

Problems with conventional reactive intermetallic systems include theirlow density, their inability to fully react, and their lack of physicalstrength necessary to survive the high-vibration environments ofmilitary hardware. This is due to the fact that approaches to date haveutilized pressed powders. Many of these systems have failed either inproduction, or through vibration testing, both of which can result infrictional initiation. As reactive powders are pressed, each powderelement has trapped gas on it, typically oxides. When reacted in ahighly constrained manner, the gases create very high, localizedpressures, which tend to tear the pressed body apart, reducing theamount of large mass available to impart thermal damage. Furthermore,long time exposure of powder metallurgy materials in storage makes themsusceptible to moisture and vibration, and their lack of inherentmechanical strength has a direct impact on the fragment size availablefor target interaction. In addition, pyrophoric solid metals thatrapidly oxidize when explosively deformed do not meet their anticipatedbenefits, since burning is typically a surface phenomenon, and the bulkof these incendiary fragments are only slightly elevated in temperature.

The present invention overcomes these problems by incorporating reactivematerials in multilayer structures, which have densities that approachtheoretical values, and which have good structural integrity and goodmechanical properties.

SUMMARY OF THE INVENTION

The invention provides devices comprising reactive multilayers whichundergo an exothermic reaction upon shock initiation. The shockinitiation devices may be shaped charges, EFP devices, warheads,munitions casings, interceptors, missiles, bombs, rocket propelledgrenades and other systems. The reactive multilayer structures of thedevices may be selected based on required structural properties, densityand reaction temperature.

An aspect of the present invention is to provide a method of making ashaped charge shock initiation device comprising: depositing layers ofreactive materials onto a substrate to form a reactive multilayerstructure comprising layers which are capable of subsequently reactingwith each other; and incorporating the reactive multilayer structure ina reactive shaped charge shock initiation device.

Another aspect of the present invention is to provide a method ofreacting a multilayer shaped charge structure comprising: forming areactive multilayer shaped charge structure comprising repeating layersof reactive components which are capable of subsequently reacting witheach other; and initiating reaction of the reactive components bysubjecting the components to shock.

These and other aspects of the present invention will be more apparentfrom the following description.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 schematically illustrates a reactive multilayer structurecomprising alternating layers of reactive components which may be usedin a shock initiation device in accordance with an embodiment of thepresent invention.

FIG. 2 schematically illustrates a reactive multilayer structurecomprising layers of reactive components separated by layers of inertmaterial which may be used in a shock initiation device in accordancewith another embodiment of the present invention.

FIG. 3 schematically illustrates a reactive multilayer structurecomprising pairs of reactive component layers separated by layers ofinert material which may be used in a shock initiation device inaccordance with a further embodiment of the present invention.

FIG. 4 is a partially schematic cross-sectional view of a reactiveshaped charge including a reactive multilayer structure in accordancewith an embodiment of the present invention.

FIGS. 5-10 are differential scanning calorimetry (DSC) scans of variousreactive multilayer structures during reaction thereof.

DETAILED DESCRIPTION

The present invention provides reactive devices including reactivemultilayer structures which may be ignited by shock initiation. As usedherein, the term “shock initiation device” means a device or componentthereof which undergoes a substantially simultaneous or bulk exothermicreaction when subjected to sufficient shock. Reactive components of thedevice undergo a substantially simultaneous exothermic reaction uponshock initiation. The shock may be generated by means such asexplosives, impact with another object or target, or the like. Thedevice may be arranged such that shock initiation results in anexothermic wave front which propagates in a direction substantiallyperpendicular to the reactive layers, thereby facilitating bulk orsubstantially simultaneous initiation of the multilayer structure.Typical shock initiation devices may disperse the reacted or reactingmaterial in a desired manner, such as a unidirectional oromnidirectional pattern.

The shock initiation devices include reactive multilayer structurescomprising at least two layers of reactive components. As used herein,the term “reactive components” means materials that exothermically reactwith each other upon shock initiation and which produce a sufficientlyhigh heat of reaction. Elevated temperatures of at least 1,000° C. aretypically achieved, for example, at least 2,000° C. In one embodiment,the reactive components may comprise elements that exothermically reactto form intermetallics or ceramics. In this case, the first reactivecomponent may comprise, for example, Ti, Ni, Ta, Nb, Mo, Hf, W, V, Uand/or Si, while the second reactive component may comprise Al, Mg, Ni,C and/or B. Typical materials formed by the reaction of such reactivecomponents include TiAl_(x) (e.g., TiAl, TiAl₃, Ti₃Al), NiAl, TaAl₃,NbAl_(x), SiAl, TiC, TiB₂, VC, WC and VAl. Thermite powders may also besuitable. In this case, one of the reactive components may comprise atleast one metal oxide selected from Fe_(x)O_(y), Ni_(x)O_(y),Ta_(x)O_(y), TiO₂, CuO_(x) and Al₂O₃, and another one of the reactivecomponents may comprise at least one material selected from Al, Mg, Niand B₄C. In one embodiment, one of the reactive components may compriseTiO₂, Al₂O₃, Fe₃O₄, SiO₂ and/or NiO₂, and another of the reactivecomponents may comprise Al, Fe, Ni, B₂O₃ and/or TiO₂. More than tworeactive components may be used, e.g., Al/Ni/NiO, Ni/Al/Ta, etc.

By proper selection of components, it is possible to form an unreactedlayered structure with a bulk composition that will chemically equal anintermetallic or ceramic compound. The unreacted body is a substantiallyfully dense solid multilayer structure complete with mechanicalproperties that permit its use as a load bearing material. Under propershock conditions (explosive or other), the materials undergo anexothermic reaction. The composition and thickness of each layer isselected such that bulk or substantially simultaneous initiation of theentire structure occurs upon shock initiation. In many types of shockinitiation devices incorporating reactive multilayers, the reacted orreacting material is dispersed in a desired manner, such as aunidirectional or omnidirectional dispersion pattern.

The present reactive multilayer structures can differ from compressedpowder materials because there is substantially no impurity outgassing.In addition, pressed powder compositions tend to rapidly disperse intopowders after shock initiation. The reactive multilayer structures alsodiffer from pyrophoric metals like zirconium because the entire bodyreaches its peak exotherm, not just the exposed edges. This permits thefragmented sections of the body to maintain thermal output levels muchlonger than either powder reactants or individual pyrophoric metals.Given the ability to control reactions via the forming process, a greatdegree of tailorability may be achieved with the present reactivemultilayers.

A partial list of candidate reactive layer materials is shown in Table1.

TABLE 1 Alloy Heat of Peak Reaction Components Reaction FluenceTemperature 2Si + V 700 cal/g 2400 cal/cm³ 3341 K 3Si + 5Ti 428 cal/g1590 cal/cm³ 2548 K 5Nb + 3Si 222 cal/g 1390 cal/cm³ 2518 K Al + Ni 330cal/g 1710 cal/cm³ 2362 K Al + Co 307 cal/g 1590 cal/cm³ 2195 K 2Si + Zr258 cal/g 1040 cal/cm³ 1988 K 2Al + Zr 267 cal/g 1130 cal/cm³ 1923 K2Si + Ti 308 cal/g  967 cal/cm³ 1913 K Mo + 2Si 187 cal/g  855 cal/cm³1854 K Ni + Si 235 cal/g 1140 cal/cm³ 1838 K 2Si + Ta 120 cal/g  851cal/cm³ 1781 K 5Al + 2Co 277 cal/g 1110 cal/cm³ 1755 K Co + Si 299 cal/g1450 cal/cm³ 1733 K 5Cr + 3Si 226 cal/g  847 cal/cm³ 1671 K 2Al + Ti 314cal/g 1100 cal/cm³ 1643 K Al + Ti 240 cal/g  872 cal/cm³ 1597 K 3Al + Fe278 cal/g 1020 cal/cm³ 1407 K

FIG. 1 schematically illustrates a reactive multilayer structure 10comprising alternating layers of a first reactive component material 12and a second reactive component material 14 which may be used in shockinitiation devices of the present invention. The layers 12 and 14typically have thicknesses of from about 10 nanometers to about 0.5 mm,preferably from about 10 nanometers to about 1 micron. The layerthicknesses are selected such that the multilayer structure 10 iscapable of substantially simultaneous or bulk initiation when subjectedto selected shock conditions. The total thickness of the multilayerstructure 10 is typically from about 100 nanometers to about 25 mm,preferably from about 1 micron to about 1 mm.

FIG. 2 illustrates a reactive multilayer structure 20 comprising layersof first and second reactive components 22 and 24, separated by layersof inert material 26 which may be used in shock initiation devices ofthe present invention. The reactive component layers 22 and 24 may havethicknesses as described above. The inert material layers 26 maycomprise any suitable material such as glasses and ceramics, and may bethermally sprayed, or may be deposited by any other suitable technique.The layers 26 may also comprise an interdiffusion zone (IDZ) between thereactive component layers 22 and 24. The thickness of each inert layer26 is typically from about 10 nanometers to about 1 mm, preferably fromabout 10 nanometers to about 10 microns.

FIG. 3 illustrates a reactive multilayer structure 30 comprising pairsof reactive component layers 32 and 34 having thicknesses as describedabove, separated by layers of inert material 36 having thicknesses asdescribed above which may be used in shock initiation devices of thepresent invention.

FIG. 4 is a sectional view of a shock initiation device in the form of ashaped charge 40 including a reactive multilayer shaped charge liner 42in accordance with an embodiment of the present invention. The shapedcharge 40 includes a casing 44 made of any suitable material such asaluminum, steel or fiber-wrap composite filled with an explosivematerial 46 made of any suitable material such as PETN, Octol or C-4. Inthe embodiment shown in FIG. 4, the reactive shaped charge liner 42 issubstantially cone-shaped. The height of such a cone-shaped linertypically ranges from about 1 to about 100 cm. The diameter of thecone-shaped liner, measured at its base, typically ranges from about 1to about 100 cm. Although a cone-shaped liner is shown in FIG. 4, othershapes may be used, such as spheres, hemispheres, cylinders, tubes,lines, I-beams and the like. In addition, the present reactivemultilayer structures may be used in other shock initiation devicesincluding munitions casings, kinetic interceptors, rocket propelledgrenades and the like. In accordance with embodiments of the presentinvention, the reactive multilayers comprise structural or load-bearingcomponents of such devices.

The multilayer structures may be formed by techniques such as vapordeposition, rolling of foils or forging. Alternatively, the multilayerstructures may be formed by thermal spraying techniques such as thosedisclosed in U.S. patent application Ser. No. 10/839,638 filed May 5,2004, which is incorporated herein by reference. Various vapordeposition techniques such as magnetron sputtering, chemical vapordeposition, electron-beam physical vapor deposition (PVD) and laserassisted PVD can be used to form the structural multilayers. Depositionparameters are selected to control the thickness of the layers and theinterdiffusion zone (IDZ) between the layers. The present multilayerstructures can be fabricated such that the initiation wave frontpropagates substantially perpendicular to the reactive layers. Thus, theentire structure can be initiated substantially simultaneously.

The energy required to initiate the exothermic reaction and the rate ofthe reaction are directly related to the physical properties, e.g.,thickness, and the composition of the IDZ. The sensitivity for shockinitiation of the exothermic reaction is defined based on thecharacteristics of the IDZ. The IDZ may be modified by varying thedeposition parameters, changing the characteristics of the depositionsubstrate, the use of inert layers, or through post deposition thermalprocessing of the multilayer material. For example, the thickness of theIDZ can be increased to a point at which local or point ignition of themultilayer structure does not occur, but bulk ignition by shockinitiation is possible. Exothermic multilayer structures can thus befabricated that can be bulk initiated by shock or impact loading but notby localized thermal or spark initiation.

The following examples are intended to illustrate various aspects of thepresent invention, and are not intended to limit the scope of theinvention.

Example 1

Samples comprising Ni/Al multilayers on copper cones were made. Themultilayers were applied using a Magnetron sputtering process. Thisprocess is done in a vacuum chamber (<10-5 Torr) using sputter guns,plasma formation and large electrical potentials to dislodge atoms froma target material and deposit them on the substrate. The process occurson the atomic level and deposition rates are influenced by factors suchas applied voltage, distance from sputter target, substrate orientation,vacuum, etc. For this series of tests, alloys AA-1100 (99% Al) andInconel 625 (61 Ni-22 Cr-2.5 Fe-9 Mo) were used as target materials.

Al/Ni coatings were formed on conical copper liners, and monolithicAl/Ni cones were formed on a mandrel and removed. However, as thecoating trials progressed, it became evident that slow sputtering rateswere associated with the latter. The time required to the requisite0.048-inch thickness would have been long. Therefore, the effortsfocused on coating copper backing liners. These liners were fabricatedusing wall thicknesses of approximately 0.024-inch. The half-thicknessliners were mounted on a rotational device driven by a toothed ring atthe base of the vacuum chamber. The liner was placed on a solid, coppermandrel, designed to closely conform to the inside dimensions of thecone. During rotation, the mandrel was in constant contact with awater-cooled, copper base plate. This configuration allowed cooling ofthe liner during the coating operations. In order to prevent diffusionand formation of unwanted nickel aluminides during sputtering, astainless steel shield was installed to mask each side of the cone.

A low sputter gun power (40-50 W) was used in order to prevent heatbuild up. This resulted in relatively low deposition rates. Othercoating efforts, with larger substrates, show that power levels of 250 Wand continuous run times of 8 hours are achievable. The rotating devicewas dismantled and ultrasonically cleaned a number of times to removeany traces of oil, grease or other contamination from crevices, holesand fasteners. In addition, stainless steel sheet was formed and placedover the frame to thermally insulate it and a conductive epoxy was usedbetween the copper liner and mandrel for more efficient heat transfer.Sample TSS-3 was run for a total of 16 hours at 150 W on both sputterguns. At the end of this period, total coating thickness was 0.006-0.011inch. The thickness varied slightly depending on location and this isbelieved to result from the slight gun-substrate standoff distancebetween the top and bottom of the cone.

After fabrication, steel containers were filled with a quantity of A-5high explosive and the conical liners were pressed into the explosive. Acritical factor in shaped charge fabrication is maintaining the axialalignment of the container, liner, detonator and explosive charge.Symmetry around the centerline is required to form a penetration jet ofthe proper shape and density. Pressing parameters (density, pressure,alignment tolerance, etc.) for these tests conformed to standardindustry practice for copper liners.

Each shaped charge was tested to determine its ability to penetrate mildsteel plate. Before each test, the underlying ground was leveled and a12×12×1-inch thick base plate was situated. Several steel target plates,8×8×1-inch thick, were stacked on the base and checked for level. Thedetonation assembly was mounted, leveled and taped in place. The resultsof testing are shown in Table 2.

TABLE 2 Explosive Entrance Sample Weight Penetration Hole ID Sample Type(g) Depth (in) Diameter (in) Comments TSS-1 Sputtered Ni/Al 50.79 4.250.50 Bright flash, ragged coating on entrance hole with copper linerevidence of burning TSS-2 Sputtered Ni/Al 50.69 3   0.50 Bright flash,“figure- coating on 8” entrance hole with copper liner evidence ofburning TSS-3 Sputtered Ni/Al 50.15 5+   0.50 Similar to TSS-1, coatingon solid portion of jet copper liner found in plate #6

Example 2

Two alloy systems were selected: nickel-aluminum and tantalum-aluminum.Two-inch cathodes (one of Ni and one of Al) are positioned in oppositedirections, at a 2 inch distance from the substrate holder (drum), whichrotates at an adjustable speed. The substrates to be deposited on arepositioned on the rotating drum, and moved past each targetsequentially. This allows deposition of the desired number of bi-layers,and desired total foil thickness, as determined by rotation speed,selected deposition rate, and total run time.

To establish predictable deposition rates for the materials, depositiononto precision gage blocks was made. This was done with one segmentcovered, that when removed after deposition left a sharp “step” from thegage block surface to the top of the deposited material. This wasmeasured using a high sensitivity lever gage indicator with submicronresolution. Gage blocks were held on the substrate holder at a distanceof 3 inches from source to substrate (target).

This was accomplished by starting with Al sputtered at a 12 W/in² DCpower density for 30 minutes duration and rotation speed of the drum of2 PRM. Multiple runs of the same parameters resulted in consistentmeasurements of thickness that could then be related to an estimate ofpredictable layer thickness per pass (of the drum past the ingot source)for each alloy. This rate was 0.75 for Al settings which related to abuild-up of approximately 12 nm per pass of the substrate. The sameprocess was repeated with Inconel for the nickel component, and a set ofrates was established for this alloy. Nickel parameters included ahigher power density setting of 14 W/in², with rotation and time thesame for the calibration runs and yielded a deposition rate of 9 nm perpass. All work is done under Ar atmosphere of 3 milliTorr.

The sputter cathodes allow fast change-out of the source material, foreasy target changes, and use of a variety of alternate materialscombinations when desired. The sputter cathodes are equipped with highstrength magnets (rare earth type magnets), which can be arranged in anumber of magnetic field configurations. Also, the small source size,each coupled with a 500 W DC power capability, gives the ability to usea sputter power density up to 150 W per square inch. This high powerdensity, coupled with the higher strength magnetic field, (and thereforehigher plasma density) results in significant increase in sputterdeposition rates, which is important with deposition of magneticmaterials like Inconel.

Also, a motor controller with adjustable speed control was installed onthe deposition system. This allowed for control of the individual layerthickness comprising the multilayers by setting and holding consistentdrum rotation speeds. Layer thickness is controlled by power density androtation speed of the drum holding the “targets”.

Once the system was set-up and equipment calibrated, several runs ofsamples were produced to record and understand the impact of powerdensity, rotation speed, cooling cycle of samples between depositionlayers, and impact of substrate on the multi-layer properties. Highersputter deposition power was feasible with the equipment upgrades, soadditional calibration process runs were completed.

Another calibration processing was completed using a silicon wafer forthe base substrate masked by a coverslide to create the “step”differential thickness that when removed provided a clean interface tomeasure the thickness of the deposited layer on the substrate. Drumrotation speeds were varied between 45 seconds/revolution and 73seconds/revolution.

The impact of varying the substrate, onto which the multi-layers weredeposited, was evaluated by comparing DSC results. Substrates usedincluded glass, aluminum foil, and copper foil. Parameter developmentwork also revealed that a cooling cycle of 5 minutes between depositionlayers was beneficial for reducing the diffusion of multiple layerstogether. Diffusion of the two elements would reduce the reactivity ofthe multi-layer.

Final parameters were established to be 200 W for nickel alloy, 250 Wfor aluminum, drum rotation rate of 73 seconds/revolution onto copperfoil substrates. These parameters produced consistent alternating layersof 7.5 nm of nickel and 7.5 nm of aluminum totaling 17 microns thick infinal form.

The processing parameters for Ta—Al were established using the sameapproach as for the Ni—Al system. Calibration methods were utilized todetermine a rate of deposition of tantalum. Preliminary PVD runs weremade of Ta/Al multilayer foils, using power settings of 300 W/200 W,respectively. To expedite the processing of initial Ta/Al multilayersfor DSC evaluation and reactive initiation properties, calibration dataobtained for the previous Ni/Al deposition, in conjunction with sputtergun manufacturer's data on relative deposition rates of various metals,the initial multilayers were deposited with an estimated bilayerthickness of 5 nm/7.5 nm

Cooling cycles were incorporated into the process to allow approximately5 min target off per each hour of run time, to insure adequate substratecooling during sample deposition. Tantalum deposition still resulted inmore heat generation, and therefore higher substrate temperature, duringdeposition as compared to either Al or Ni processing. Substrate rotationspeed of 0.8 rev/min (73 sec per drum revolution) was again used for theinitial multi-layer sample deposition. Copper foil substrates, 3″×7″×25mil thickness were used. Deposition was conducted for a total run timeof 4 hours, after which the multi-layer Ta/Al foil material was removedby flexing the copper substrate to cause delamination. Initiation of thefoil was initiated with a butane lighter flame. Vigorous initiation ofthis material was observed, with a white shade of visible light givenoff, compared to the orange characteristic light present in initiationof Ni/Al multilayer foils.

Greater substrate heating was present in the Ta deposition, presumablydue to less sputtered material per Watt input to the sputter gun, aswell as tantalum's thermal properties resulting in a higher temperatureat the sputter target surface. This effect resulted in two distinctdeposition zones on the coated copper substrate, with a more vigorousinitiation given by the outer “cool” zone as compared to the center“hot” zone, which may have partially inter-diffused during deposition.Samples of material from each zone is currently underwent DSC analysis.

Using the parameters established in the calibration and optimizationruns, multiple samples were produced for the initiation testing.Repeating equal layers of aluminum and Inconel (7.5 nm/layer) weredeposited onto copper foil substrates that were approximately 6″tall×10″ wide×25 mils thick. A grid was established on the copper sheetusing high-temperature, vacuum-compatible tape (Kapton tape/siliconeadhesive) to create rectangles of multi-layer foil approximately 1″×2″in size for the initiation testing. After processing, reactive foilswith even alternating layers resulted in 17 mm thick foils forinitiation testing.

Differential scanning calorimetry (DSC) was performed on freestandingmulti-layer material (material removed from substrate prior to DSC run).This analysis measured heat flow as a function of scan temperature ofseveral milligrams of each of the multi-layer sample materials.Specimens were subjected to a heating cycle that ramped from ambienttemperature up to 700° C. at a scan rate of 5 deg/min. Relatively largeexothermic peaks were noted at scan temperature from 200 to 300° C.,with a double peak evolving in some of the scans.

The sharp peak indicates a rapid increase in heat flow indicatinginitiation of the exothermic reaction. Sharp peaks represent fastreaction propagation, while wider peaks, are indicative of a slowermoving reaction.

For the Ni—Al foils, DSC results were collected for multi-layer foilsdeposited on glass, foil and copper substrates. FIGS. 5-8 show DSC scansfor the Ni—Al foils. FIG. 5 is a DSC scan of Ni—Al on the foilsubstrate. FIG. 6 is a DSC scan of Ni—Al on a glass substrate. FIG. 7 isa DSC scan of a sample with relatively thick bi-layers of Al, resultingin more total heat output. FIG. 8 is a DSC scan of Ni—Al produced with aslower rotation speed, resulting in lower heat output possibly due togreater heating of the sample during deposition of the multilayersresulting in more interdiffusion between the layers. The DSC resultsvaried with this possibly indicating the heat-sink effect of a metallicsubstrate is preferable to the insulating effect of a glass substratefor making these reactive foils. Also, a scan with proportionally richeraluminum layers exhibited a different exotherm peak than the sharp spiketypical of the other foils.

The Ta—Al DSC scans showed a higher peak for the reaction than the Ni—Alscans. FIG. 9 is a DSC scan of the Ta—Al multilayer structure from aninner region of the deposited material. FIG. 10 is a DSC scan for theTa—Al multilayer from an outer region of the deposited material. Thereappeared to be differences in the outer and inner regions of thedeposited target area. DSC runs were completed on materials from theseareas and in fact do exhibit different behavior.

The slightly greater peak height seen in the “outer” region could be aresult of more efficient cooling of that area versus the “inner” regionduring deposition. More efficient cooling leaves less chance ofinter-diffusion of the layers that can impact the exothermic reaction.

Testing was conducted on foils composed of nickel and aluminum layerswith the objective of documenting various levels of thermal and pulsedenergy sources that would cause initiation of an exothermic reaction.Foils were exposed to standard matches, electric matches, igniter, andtwo power levels of EBW detonators. Results showed that foils of nickeland aluminum multi-layers materials initiated a reaction from thethermal and energetic sources. Foils well bonded to a copper substrateare not initiated by the thermal input from a match, but they areinitiated by sparks form an electric match and shock from a detonator.

Testing was completed at a ballistic testing laboratory on an indoorrange. Foils of layered material were adhered to a steel plate and thevarious initiation sources were mounted at specific stand-off distancesfrom the foils. These stand-offs were established in related testing andwere selected to ensure samples were not destroyed, but still exposed tothe energy sources. A flash detector was used to trigger capture of agated video still image of the exothermic reaction.

Foils tested included samples where the foil was backed by copper plate,which is the condition these samples were manufactured. Foils were alsotested that were removed from the copper backing and were placed againstthe steel backing plate and secured by tape.

For each initiation source, a still photo of the detonation action ofthe source only (no foil in place) was taken to test instrumentation andalso to document any flash and debris attributed directly to thedetonation. For further comparison, “before” firing images were recordedon the foil set-up prior to initiation of the initiation sources.

SQ-80 igniters contain 450 mg of a Thermite mix. RP-3 detonators have asmall amount of explosive (30 mg of PETN) and are generally used forsituations where minimum fragmenting debris is desired. The RP-501detonator is a general-purpose “higher energy” explosive containing 136mg PETN for initiation with 227 mg RDX with binder for output explosive.

Table 3 below shows data recorded for each test. Each initiation sourcewas attempted twice on copper backed foils, and test sequence wasrepeated on unbacked foils. Initiation sources included a standardmatch, electric match, SQ-80 igniter, RP-3 detonator, and RP-501detonator. There were limited quantities of RP-3 detonators availablefor testing, so a repeated test was not completed on the foil on coppersample using that detonator.

TABLE 3 Shot-by-Shot Data for Initiation Testing of Layered Foils ShotFoil Initiation # Configuration Source Initiation Comment 1 Foil on CuMatch Yes A protruding piece of foil not touching the copper initiatedthe reaction 2 Foil only Match Yes 3 Foil on Cu Match No Full contactwith flame was made, but no initiation resulted 4 Foil only Match Yes 5Foil on Cu Electric Yes Electric match was touching foil Match surface 6Foil on Cu Electric Yes Electric match touching foil surface Match 7Foil on Cu Electric Yes ½″ offset between match and foil Match surface 8Foil only Electric Yes ½″ offset between match and foil Match surface 9Foil only Electric Yes ½″ offset between match and foil Match surface 10Foil on Cu SQ-80 Yes 5″ stand-off 11 Foil on Cu SQ-80 Yes 5″ stand-off12 Foil only SQ-80 Yes 5″ stand-off 13 Foil only SQ-80 Yes 5″ stand-off14 Foil on Cu RP-501 Yes 6″ stand-off 15 Foil on Cu RP-501 Yes 6″stand-off 16 Foil only RP-501 No Foil had breaks in surface prior todetonation. 17 Foil only RP-501 No Foil integrity was good prior tofiring, no apparent reaction occurred 18 Foil on Cu RP-3 Yes ½″stand-off 19 Foil only RP-3 Yes ½″ stand-off - foil in pieces, butappeared to have reacted 20 Foil only RP-3 Yes ½″ stand-off, foil hadtape over the front face to hold pieces together. Foil was reacted underthe tape along radial lines from impact point.

In the data, there are some outliers from the general trend ofinitiation of reactions. Using the standard match, the foils on copperbacking did not initiate unless there was a section of foil notcontacting the copper backing. In shots 1 and 3 this difference wasclearly visible in that shot 1 resulted in a reaction, but shot 3 didnot.

The foils subjected to the higher energy RP-501 detonators also did notshow conclusive initiation of foils in shots 16 and 17 where the foilonly, (no copper backing), were tested. It is believed that theexplosive force of the detonation physically separated the foil beforeany reaction had time to propagate. Foils on copper backing, shots 14and 15, did successfully result in an exothermic reaction initiating.

This example demonstrates that exothermic reactions were initiated inlayered foils using electric matches, igniters and two different energylevels of detonators. Reaction of foil on copper backing was notinitiated using a standard match when the foil did not have “cracks”.Foils not backed with copper, were initiated using standard matches withflames contacting the surface. Foils that had protruding sections fromthe plane of the foil, and were therefore separated from the copperbacking, were ignited using a standard match.

Example 3

Repeating equal layers of aluminum and Inconel were deposited ontocopper foil substrates that were approximately 6″ tall×10″ wide×25 milsthick. A grid was established on the copper sheet usinghigh-temperature, vacuum-compatible tape (Kapton tape/silicone adhesive)to create rectangles of multi-layer foil approximately 1″×2″ in size forthe initiation testing. After processing, reactive foils with evenalternating layers resulted in 17 mm thick foils for initiation testing.Very thin 100 micron thick Inconel/Al exothermic multilayer foilsfabricated using the magnetron sputter deposition process achievedtensile strengths of 300 Mpa.

Differential scanning calorimetry was performed on freestandingmulti-layer material (material removed from substrate prior to DSC nm).This analysis measured heat flow as a function of scan temperature ofseveral milligrams of each of the multi-layer sample materials.Specimens were subjected to a heating cycle that ramped from ambienttemperature up to 700° C. at a scan rate of 5 deg/min. Relatively largeexothermic peaks were noted at scan temperature from 200 to 300° C.,with a double peak evolving in some of the scans.

The sharp peak indicates a rapid increase in heat flow indicatinginitiation of the exothermic reaction. Sharp peaks represent fastreaction propagation, while wider peaks, and hence more energy asdefined by the area under the peak, are indicative of a slower movingreaction.

Testing was conducted on nickel-aluminum foils of approximately 1″×1″×17mm with the objective of determining a boundary for impacts that wouldcause initiation of an exothermic reaction. Once this range wasdetermined, shots were fired to attempt to capture the time betweenimpact and the start of the exothermic reaction.

Testing was completed at a ballistic testing laboratory on an indoorrange. Foils of layered material were used as “targets” against which a17 grain Fragment Simulating Projectile (FSP) MIL-P-46593A (MU) wasfired at varying velocities. Instrumentation was used to capturevelocity of the projectile, delay between impact and initiation of thereaction, and still photographs of the impact. Velocities werecontrolled using initial positioning of the projectile in the barrel anddifferent propellant loading.

Foils tested included samples where the foil was backed by copper plate.Foils were secured to a brass disk about 3″ diameter by ¼″ thick usingtape. This brass disk backing was put in place to eliminate the sparkfrom the projectile hitting the steel backing plate. This insured theflash detector picked up the flash of a reaction initiating. The flashdetector was tested using a standard match, which triggered a detectionof light. The brass disk was secured to a steel plate in a frame 4.97meters from the firing barrel. The projectiles passed through two setsof screens triggering chronographs prior to hitting the target. Thefigures below show the range set-up. After the minimum velocity at whichreactions initiated was determined, the set-up was modified slightly toenable capture of the timing between impact and the start of theexothermic reaction. This involved putting a “make” screen on top of thefoil to indicate a completed circuit when the projectile contacted itthereby triggering the start of the timing indicator for the sequence ofimpact to detection of a flash indicating initiation of the foil.

Table 4 below shows the shot-by-shot data recorded for the testing. Theinitial shots were fired at a range of 4.97 meters from end of firingbarrel to the front face of the test foil. To accommodate slowervelocities needed to bracket the point of “go/no-go” for the initiationof the exothermic reaction, the target was moved closer to 1.98 m.

The velocity at which foils were ignited by impact ranged from a slowestof 129.6 m/s to the highest of 628.1 m/s. Velocities of 111.4 m/s and111.6 m/s did not result in initiation of a reaction upon impact. Thisbrackets the velocity to start the reaction between 111.4 m/s and 129.6m/s. The velocities reported are striking velocities as calculated fromactual measurement of the projectile velocity taken while passingthrough two sets of triggering screens at specified distances.

There was one “outlier” in the data for shot number 22 in which avelocity of 236.8 m/s did not initiate a reaction in the foil. It is notclear why this was the case for this sample. However, in the highervelocity impacts, it was evident that the foils were sometimes separatedmechanically (blown apart) from the impact faster than the reactioncould propagate from the initial impact site. It is believed this resultis an artifact of the testing foil thickness of approximately 17 micronsmaking them fragile and susceptible to cracking during handling forpositioning for the testing.

The delay between measure impact and flash detection indicatinginitiation of a reaction, varied for the four samples on which it wasmeasured. The range of delays was between 210 microseconds and 2028microseconds. Table 5 below shows this data separately.

TABLE 4 Shot-by-Shot Data for Impact Initiation Testing of Layered FoilsShot Distance to Velocity Initia- # Target (m/s) tion Comment 1 4.57 m340.4 Yes Steel backer plate 2 4.57 m 557.9 Yes Steel backer plate 34.57 m 554.9 N/A No foil - instrumentation test 4 4.57 m 628.1 Yes Steelbacker plate 5 4.57 m 337.0 N/A No foil - instrumentation test 6 4.57 m541.1 N/A No foil - instrumentation test 7 4.57 m 549.5 N/A No foil -instrumentation test 8 4.57 m 338.8 N/A No foil - instrumentation test 94.57 m 310.0 Yes Brass disk mounting started 10 4.57 m 545.0 Yes 11 4.57m 332.0 Yes 12 4.57 m 184.2 N/A Missed sample 13 4.57 m 170.5 N/A Missedsample 14 4.57 m 165.3 N/A Missed sample 15 1.98 m 234.3 Yes 16 1.98 m192.4 Yes 17 1.98 m 111.4 No 18 1.98 m 111.6 No 19 1.98 m 129.6 Yes 201.98 m 237.9 Yes Delay = 1802 microseconds 21 1.98 m 243.9 N/A No foil -instrumentation test 22 1.98 m 236.8 No Outlier relative to other tests23 1.98 m 228.2 Yes Delay = 2028 microseconds 24 1.98 m 232.9 Yes Delay= 1519 microseconds 25 1.98 m 380.7 Yes Delay = 210 microseconds 26 1.98m 377.8 Yes Delay = 321 microseconds 27 1.98 m 380.5 Yes No flashreading 28 1.98 m 386.8 Yes No flash reading

TABLE 5 Impact to Flash Detection Delay Comparisons Shot # Velocity(m/s) Delay (microseconds) 20 237.9 1802 23 228.2 2028 24 232.9 1519 25380.7 210 26 377.8 321

Impacting bodies at a striking velocity of 129.6 m/s had sufficientenergy to initiate an exothermic reaction of layered nickel and aluminumfoils 17 microns thick.

Impacting bodies at a striking velocity of 111.5 m/s did not havesufficient energy to initiate an exothermic reaction of layered nickeland aluminum foils 17 microns thick.

At higher velocities (>370 m/s), the integrity of the foil after impactappeared to have an impact on the ability of the exothermic reaction topropagate through the test foil.

The time delay between impact and the detection of the flash indicatinginitiation of an exothermic reaction varied with the striking velocityof the impacting body. More data would be required to determine thevalidity of this correlation.

Example 4

The sensitivity to initiation of exothermic multilayer structures can becontrolled by varying thermal state during deposition. Multilayerstructures were deposited on glass, aluminum foil, and copper foilsubstrates. Parameter development work revealed that a cooling cycle of5 minutes between deposition layers is also beneficial for reducing thediffusion of multiple layers together. Diffusion of the two elementsreduces the reactivity of the multi-layer. Using the parametersestablished in calibration and optimization runs, multiple samples wereproduced for the initiation testing. Layers of aluminum (7.5 nm/layer)and Inconel (7.5 nm/layer) were deposited onto substrates. DSC resultswere collected for Ni—Al multi-layer foils deposited on glass, foil andcopper substrates. The DSC results showed that the sensitivity washigher when a thermally conductive metallic substrate was used.

Example 5

A water-cooled rotation stage was installed in a PVD system. The sputterguns were re-mounted and oriented so as to deposit onto the rotatingcooled mandrel. A stainless steel shield, with a cutout to accommodatethe deposition mandrel, was positioned so as to have incident depositionfrom each sputter source onto separate sides of the mandrel, whilerotating. This setup allows for reactive multilayer structures,comprised of alternating layers of two metals, to be deposited onto themandrel. By varying the rotation speed of the mandrel and the depositionrate of the individual metals, bilayer thickness and the ratio of thetwo materials can be controlled. The cooled mandrel will insure thatinterdiffusion between the layers is minimized. Alternatively, byvarying the mandrel temperature (by controlling coolant temperature)differing levels of multilayer interdiffusion can be achieved.

Whereas particular embodiments of this invention have been describedabove for purposes of illustration, it will be evident to those skilledin the art that numerous variations of the details of the presentinvention may be made without departing from the invention.

1: A method of making a shaped charge shock initiation devicecomprising: depositing layers of reactive materials onto a substrate toform a reactive multilayer structure comprising layers which are capableof subsequently reacting with each other; and incorporating the reactivemultilayer structure in a reactive shaped charge shock initiationdevice. 2: The method of claim 1, wherein the deposition processcomprises magnetron physical vapor deposition, electron-beam physicalvapor deposition or chemical vapor deposition. 3: The method of claim 1,further comprising removing the reactive multilayer structure from thesubstrate. 4: The method of claim 1, wherein the substrate comprises amandrel. 5: The method of claim 1, wherein the reactive materials aredeposited on the substrate at a rate of at least 0.01 mm per hour. 6:The method of claim 1, wherein each of the layers has a thickness offrom about 1 micron to about 5 mm. 7: The method of claim 1, wherein thelayers of reactive materials are directly adjacent each other. 8: Themethod of claim 1, further comprising forming an interdiffusion zonebetween adjacent reactive material layers. 9: The method of claim 8,wherein the interdiffusion zone inhibits reaction between the reactivematerial layers when the multilayer structure is subjected to alocalized heat source. 10: The method of claim 8, wherein theinterdiffusion zone has a thickness sufficient to prevent reactionbetween the reactive material layers when the multilayer structure issubjected to a localized heat source. 11: The method of claim 1, whereinthe reactive material layers are separated from each other. 12: Themethod of claim 11, wherein the reactive material layers are separatedby at least one layer of inert material. 13: A method of reacting amultilayer shaped charge structure comprising: forming a reactivemultilayer shaped charge structure comprising repeating layers ofreactive components which are capable of subsequently reacting with eachother; and initiating reaction of the reactive components by subjectingthe components to shock. 14: The method of claim 13, wherein the shockis provided by an explosive. 15: The method of claim 13, wherein theshock is provided by impact of the device with an object. 16: The methodof claim 13, further comprising dispersing the components. 17: Themethod of claim 16, wherein the components are dispersed after they aresubjected to the shock. 18: The method of claim 16, wherein thecomponents are dispersed in a pattern.